Chemical Mechanical Planarization Of Semiconductor Materials

Author: M.R. Oliver
Editor: Springer Science & Business Media
ISBN: 3662062348
Size: 18,27 MB
Format: PDF, Docs
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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Wafer Bonding

Author: Marin Alexe
Editor: Springer Science & Business Media
ISBN: 9783540210498
Size: 17,85 MB
Format: PDF, ePub
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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Predictive Simulation Of Semiconductor Processing

Author: Jaroslaw Dabrowski
Editor: Springer Science & Business Media
ISBN: 9783540204817
Size: 20,92 MB
Format: PDF, Mobi
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Predictive Simulation of Semiconductor Processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.

Advances In Chemical Mechanical Planarization Cmp

Author: Suryadevara Babu
Editor: Woodhead Publishing
ISBN: 0081002181
Size: 12,55 MB
Format: PDF, ePub, Mobi
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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Advances In Chemical Mechanical Polishing

Author: Duane S. Boning
Editor:
ISBN:
Size: 11,10 MB
Format: PDF, ePub, Mobi
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While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. Applications include planarization of surface topography, "polish back" or creation of in-laid materials in other structures, and reduction of surface roughness (e.g., for 3D wafer bonding and substrate engineering). This volume, the seventh in an annual series on CMP, presents new advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems-for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deeptrench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads (grooving, fixed abrasive, ceramic coated) and slurries (SiO2, Al2O3, CeO2, coated or doped, polymer or BN as abrasive) are presented. Novel polishing methods and equipment such as controlled high-pressure atmosphere, water jet conditioning or novel polishing head designs are described. Advances in CMP process understanding and modeling are also highlighted.

Design For Advanced Manufacturing Technologies And Processes

Author: LaRoux Gillespie
Editor: McGraw Hill Professional
ISBN: 1259587460
Size: 18,38 MB
Format: PDF
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Cutting-edge coverage of the new processes, materials, and technologies that are revolutionizing the manufacturing industry Expertly edited by a past president of the Society of Manufacturing Engineers, this state-of-the-art resource picks up where the bestselling Design for Manufacturability Handbook left off. Within its pages, readers will find detailed, clearly written coverage of the materials, technologies, and processes that have been developed and adopted in the manufacturing industry over the past sixteen years. More than this, the book also includes hard-to-find technical guidance and application information that can be used on the job to actually apply these cutting-edge processes and technologies in a real-world setting. Essential for manufacturing engineers and designers, Design for Advanced Manufacturing is enhanced by a host of international contributors, making the book a true global resource. • Information on the latest technologies and processes such as 3-D printing, nanotechnology, laser cutting, prototyping, additive manufacturing, and CAD/CAM software tools • Coverage of new materials including nano, smart, and shape-memory alloys, in steels, glass, plastics, and composites

Kristalloptik Beugung Crystal Optics Diffraction

Author: S. Flügge
Editor: Springer-Verlag
ISBN: 3642459595
Size: 18,58 MB
Format: PDF
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American Book Publishing Record

Author:
Editor:
ISBN:
Size: 18,74 MB
Format: PDF
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Technologie Hochintegrierter Schaltungen

Author: Dietrich Widmann
Editor: Springer-Verlag
ISBN: 3642970591
Size: 14,46 MB
Format: PDF, Docs
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Im vorliegenden Buch wird die Technologie von hochintegrierten Schaltungen behandelt. Es werden zunächst sehr ausführlich und praxisnah die verschiedenen technologischen Verfahren und Einzelprozesse aus den Bereichen Lithographie, Schicht-, Ätz- und Dotiertechnik beschrieben. Danach folgen Beispiele für die Integration der Einzelprozesse zur Herstellung von CMOS-, Bipolar- und BICMOS-Schaltungen. Sowohl die Einzelprozesse als auch die Prozeßintegration sind anschaulich mit zahlreichen Bildern dargestellt. Das Buch vermittelt nicht nur eine gute Übersicht, sondern auch sehr detaillierte Informationen über den modernsten Stand der Technologie hochintegrierter Schaltungen, wie sie z.B. bei der Herstellung des dynamischen IMEGA-Bit-Speichers Anwendung findet. Darüber hinausgehende Entwicklungen, die in den Sub-Mikrometer-Bereich führen, werden ebenfalls beschrieben.