Future Trends In Microelectronics

Author: Serge Luryi
Editor: John Wiley & Sons
ISBN: 1119069173
File Size: 14,75 MB
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Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities. Describes the expansion of the field into hot topics such as energy (photovoltaics) and medicine (bio-nanotechnology) Provides contributions from leading industry professionals in semiconductor micro- and nano-electronics Discusses the importance of micro- and nano-electronics in today’s rapidly changing and expanding information society Future Trends in Microelectronics: Journey into the Unknown is written for industry professionals and graduate students in engineering, physics, and nanotechnology.

Future Trends In Microelectronics

Author: S. Luryi
Editor: Springer Science & Business Media
ISBN: 9400917465
File Size: 59,78 MB
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Silicon technology has developed along virtually one single line: reducing the minimal size of lithographic features. But has this taken us to the point of diminishing returns? Are we now at a turning point in the logical evolution of microelectronics? Some believe that the semiconductor microelectronics industry has matured: the research game is over (comparisons with the steel industry are being made). Others believe that qualitative progress in hardware technology will come roaring back, based on innovative research. This debate, spirited as it is, is reflected in the pages of Future Trends in Microelectronics, where such questions are discussed. What kind of research does the silicon industry need to continue its expansion? What is the technical limit to shrinking Si devices? Is there any economic sense in pursuing this limit? What are the most attractive applications of optoelectronic hybrid systems? Are there any green pastures beyond the traditional semiconductor technologies? Identifying the scenario for the future evolution of microelectronics will present a tremendous opportunity for constructive action today.

Future Trends In Microelectronics

Author: Serge Luryi
Editor: Wiley-IEEE Press
ISBN:
File Size: 33,10 MB
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CMOS technology issues: smaller transistors; making transistors with different or better materials; the real limit to shrinking devices - technological or economic; Beyond CMOS; Femto-electronics; Molecular electronics; Superconductors and molecular-conductors; Bio-nanoelectronics ; Self-assembling of top-down lithography; Evolution/revolution in computing architectures; Optical Computing; Bio-informatics; Non-lithographic nanofabrication; Non-semiconductor electronics; Macro-electronics; Non-von Neumann computing; DNA assisted self-assembling and packaging; Carbon nanotubes; Views from industry ELECTRONIC DEVICES, SEMICONDUCTOR DEVICES.

2000 22nd International Conference On Microelectronics

Author: IEEE Electron Devices Society
Editor: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780352353
File Size: 27,77 MB
Format: PDF, Docs
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The papers in this volume are a partial selection from the International Conference on Microelectronic 1999 which provides a forum for the presentation and discussion of the recent developments and future trends in the field of microelectronics."

Microelectronics In Space Research

Author: Robert M. Burger
Editor:
ISBN:
File Size: 56,67 MB
Format: PDF, ePub, Mobi
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Microelectronics Technology And Devices Sbmicro 2003

Author: J. A. Martino
Editor: The Electrochemical Society
ISBN: 9781566773898
File Size: 34,47 MB
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Microelectronics In Western Europe

Author: Klaus P. Friebe
Editor:
ISBN:
File Size: 19,47 MB
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Mechanics Of Microelectronics

Author: G.Q. Zhang
Editor: Springer Science & Business Media
ISBN: 1402049358
File Size: 41,80 MB
Format: PDF, ePub
Read: 7018
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This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Author: 国立国会図書館 (Japan)
Editor:
ISBN:
File Size: 58,14 MB
Format: PDF, Kindle
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Microelectronics Packaging Handbook

Author: Rao Tummala
Editor: Springer Science & Business Media
ISBN: 9780412084515
File Size: 12,21 MB
Format: PDF, Kindle
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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Materials In Microelectronic And Optoelectronic Packaging

Author: Hung C. Ling
Editor: Amer Ceramic Society
ISBN:
File Size: 67,92 MB
Format: PDF, Kindle
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Seminar On Automotive Microelectronics State Of The Art And Future Developments

Author:
Editor:
ISBN:
File Size: 50,10 MB
Format: PDF, ePub, Mobi
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Electronics Now

Author:
Editor:
ISBN:
File Size: 35,64 MB
Format: PDF, Kindle
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Microelectronics And Clothing

Author:
Editor:
ISBN:
File Size: 49,82 MB
Format: PDF, Docs
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Proceedings

Author:
Editor:
ISBN:
File Size: 30,58 MB
Format: PDF, ePub
Read: 1122
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Proceedings Of The 1988 International Symposium On Microelectronics

Author: International Society for Hybrid Microelectronics
Editor: International Society of Hybrid
ISBN:
File Size: 31,54 MB
Format: PDF, Kindle
Read: 5308
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Cumulative Book Index

Author:
Editor:
ISBN:
File Size: 33,94 MB
Format: PDF
Read: 4426
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A world list of books in the English language.

Microelectronic Packaging

Author:
Editor: Plenum Publishing Corporation
ISBN:
File Size: 60,13 MB
Format: PDF, Docs
Read: 6966
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Good,No Highlights,No Markup,all pages are intact, Slight Shelfwear,may have the corners slightly dented, may have slight color changes/slightly damaged spine.