Semiconductor Advanced Packaging

Author: John H. Lau
Editor: Springer Nature
ISBN: 9811613761
File Size: 21,87 MB
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Semiconductor Advanced Packaging
Language: en
Pages:
Authors: John H. Lau
Categories:
Type: BOOK - Published: - Publisher: Springer Nature

Books about Semiconductor Advanced Packaging
ITI Submission to the Risks in the Semiconductor Manufacturing and Advanced Packaging Supply Chain
Language: en
Pages: 16
Authors: John H. Lau
Categories: Semiconductor industry
Type: BOOK - Published: 2021 - Publisher:

While ITI represents the breadth of the technology sector and counts several leading global semiconductor manufacturers amongst our membership, our response is informed by an end-user perspective on the importance of semiconductors to our industry. Semiconductors represent the foundational building blocks of – and serve as a fundamental enabler of
Materials for Advanced Packaging
Language: en
Pages: 969
Authors: Daniel Lu, C.P. Wong
Categories: Technology & Engineering
Type: BOOK - Published: 2016-11-18 - Publisher: Springer

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications.
The Electronics Handbook
Language: en
Pages: 2640
Authors: Jerry C. Whitaker
Categories: Technology & Engineering
Type: BOOK - Published: 2018-10-03 - Publisher: CRC Press

During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation,
Integrated Circuit Packaging, Assembly and Interconnections
Language: en
Pages: 300
Authors: William Greig
Categories: Technology & Engineering
Type: BOOK - Published: 2007-04-24 - Publisher: Springer Science & Business Media

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various